PART |
Description |
Maker |
MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN5X5-32 |
Package Outline
|
Global Mixed-mode Techn...
|
WDFN3X3-10 |
Package Outline
|
Global Mixed-mode Techn...
|
PG-LQFP-64-13 PG-LQFP-64-5 PG-LQFP-64-4 |
Package Outline
|
Infineon
|
LQFP44 |
Package outline
|
Philips
|
TQFN3X6-32 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP3X3-5 |
Package Outline
|
Global Mixed-mode Techn...
|
PG-LQFP-64-12 PG-LQFP-64-19 PG-LQFP-64-22 PG-LQFP- |
Package Outline
|
Infineon
|